x86 SBCs and COM Solutions
We have a vast range of industrial-embedded 8086-based single-board computers (SBC) and computer-on-module (COM) systems.
We can supply the boards along with power supplies, RAM and storage, as well as the enclosures and mounting hardware.
Boards come in many sizes and power levels, ranging from tiny PICO-ITX boards all the way up to full-size ATX boards for servers and other power-hungry applications.
- x86 is a well-established architecture
- Used in current desktop and laptop computers
- Highly scalable technology
These high-specification compact boards (170 mm x 170 mm) are suitable for a wide range of applications, such as kiosks, terminals and remote monitoring.
They can feature a range of processor options, from Celeron to high-power Intel Core processors and AMD Ryzen chipsets, with advanced graphics performance.
These high-specification ultra-compact boards (147 mm x 140 mm) are suitable for a wide range of applications, such as kiosks, terminals and remote monitoring.
They are smaller than the Mini-ITX format but with similar specifications, making them ideal for use in confined spaces that still need lots of processing power and ports.
Our EPIC range of boards consists of small, fanless, low-power boards, which are available with a range of processors and I/O options.
The EPIC series of boards is built to the smallest form factor capable of supporting socket-type processors, and include the most desired features for industrial users, such as multiple I/O ports, wide voltage input, and outstanding computing performance in a compact design.
These small form factor boards (100 mm x 72 mm) pack more than their fair share of computing power, many with low-power ATOM-based processors making them ideal for fanless, compact, low-power computing.
The family of sub-compact embedded 3.5” (146 mm x 101.7 mm) single-board computers are built with industry-leading expertise and experience in designing compact, rugged boards.
These boards support a wide range of processors, allowing users the flexibility of choosing a system with high performance or low power consumption.
Sub-compact boards are designed to work in harsh, industrial environments and offer the processing power to be deployed in a wide range of applications, ranging from machine controllers to kiosks to embedded network platforms.
ATX and µATX
These motherboards are the most powerful and allow for high-end processing, RAM and expansion ports for high-performance computing.
Industrial ATX and µATX motherboards are ideal for high-power/cost-sensitive applications. These industrial motherboards enable high performance and high integration in a standard format with a huge array of expansion ports and slots.
The main differences between these two board types are overall size; the ATX board is 305 mm x 243 mm whereas the µATX is 243 mm x 243 mm and usually has fewer PCIe lanes and less RAM capacity.
This uses a computer-on-module (COM) form factor and is a highly integrated and compact computer that can be used in a design application much like an integrated circuit component.
Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. I/O signals are mapped to two high-density, low-profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach.
The COM modules plug into a baseboard that is typically customised for its specific application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions.
COM Express is commonly used in industrial, military, aerospace, gaming, medical, transportation, Internet of Things (IoT) and general computing embedded applications.
SMARC is a low-power embedded architecture platform for Computer-on-Module based systems, based on both X86 and ARM processors.
SMARC is a similar concept to the COM Express modules in that it is a computer-on-module form factor with a highly integrated design.
Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. I/O signals are mapped to two high-density, low-profile connectors on the bottom side of the module.